pk423 (v1.0) september 30, 2010 www.xilinx.com 1 ? 2010 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks o f xilinx in the united states and other countries. all other trademarks are the property of their respective owners. average weight: 0.7170g pk423 (v1.0) september 30, 2010 100% material declaration data sheet FTG256 package for spartan-6 fpgas component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.01192 1.663 silicon 7440-21-3 100.00 0.01192 die attach material 0.002453 0.342 silver 7440-22-4 77.50 0.001901 bismaleimide monomer trade secret 15.00 0.000368 acrylate monomer trade secret 7.50 0.000184 mold compound 0.384597 53.640 solid epoxy resin trade secret 5.00 0.019230 phenol resin trade secret 5.00 0.019230 fused silica 60676-86-0 87.45 0.336330 metal hydroxide trade secret 2.00 0.007692 carbon black 1333-86-4 0.55 0.002115 substrate 0.184309 25.706 copper 7440-50-8 14.12 0.026027 nickel 7440-02-0 6.23 0.011479 gold 7440-57-5 1.24 0.002284 core epoxy resin trade secret 24.33 0.044844 inorganic filler 21645-51-2 9.12 0.016809 fiberglass 65997-17-3 24.32 0.044825 copper 7440-50-8 3.04 0.005603 solder mask talc 14807-96-6 0.88 0.001622 morpholine derivative trade secret 0.53 0.000973 barium sulfate 7727-43-7 7.74 0.014272 silica 7631-86-9 0.18 0.000324 dipropylene glycol monomethyl ether 34590-94-8 4.58 0.008434 epoxy resin 85954-11-6 3.70 0.006812 gold wire 0.009626 1.343 gold 7440-57-5 99.05 0.009534 palladium 7440-05-3 0.95 0.000091 calcium 7440-70-2 0.00 0.000000
100% material declaration data sheet FTG256 package for spartan-6 fpgas pk423 (v1.0) september 30, 2010 www.xilinx.com 2 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the produ ction, test and assembly of hardware devices to independent third-party vendors and materials supplie rs (?contractors?). all data provided hereunder is based on information received from contractors. xili nx has not independently verified the accuracy or completeness of this information which is provided so lely for your reference in connection with the use of xilinx products. solder balls 0.124093 17.307 tin 7440-31-5 96.50 0.119750 silver 7440-22-4 3.00 0.003723 copper 7440-50-8 0.50 0.000620 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total date version description of revisions 09/30/10 1.0 initial xilinx release.
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